News

Nikon are providing incentive pricing for NIS upgrades to allow operation on Windows 10.

Software Update Agreements are available to get you up to the latest version of NIS, which will allow the transition to Windows 10.

Whether it's now or something you need to budget for, contact us to ask for a quotation or if you have any questions about what exactly is required. With current NIS promotional pricing, now is the time to get ready. Offer ends 29 February 2020.

Significant savings are now available on Nikon's range of optical microscopes and digital cameras.

Contact us today for a quotation !

Sale ends 31 January 2020             

The latest model in the Sona back-illuminated sCMOS microscopy camera series has arrived.

The NEW Sona 4.2B-6 provides a superb balance of sensitivity, speed and resolution, making it perfectly suited to many challenging imaging applications. The new model joins the Sona 4.2B011, which offers the largest possible field of view at 32mm.

Features:

• High sensitivity: Up to 95% QE
• Fast Speeds: Up to 74fps
• Large Field of View: Up to 32mm
• Deep Cooled: -45°C cooling
• Protected: Ultravac^TM sensor enclosure

Download the datasheet, read more or contact us for further information.

Friday 13 December

            Auckland (NZDT) : 5:00am
            Brisbane (AEST) : 2:00am
            Sydney, Canberra, Melbourne, Hobart (AEDT) : 3:00am
            Adelaide (ACDT) : 2:30am
            Perth (AWST) : 12:00am

Register

Energy Dispersive Spectroscopy (EDS) and EBSD are well-established microanalysis tools for today's characterisation laboratories. New developments in both hardware and software allow for improved efficiencies for users. In this webinar, improvements using EDAX's APEX^TM and OIM^TM Analysis software will be presented, showing users how they can accomplish more with less effort and time.

Presented by EDAX EBSD Product Manager, Matt Nowell.

Tuesday 17 December

            Auckland (NZDT) : 10:00pm
            Brisbane (AEST) : 7:00pm
            Sydney, Canberra, Melbourne, Hobart (AEDT) : 8:00pm
            Adelaide (ACDT) : 7:30pm
            Perth (AWST) : 5:00pm

Register

Recent advances in 3D Optical Metrology accelerate in-line quality control for both front and back end processes. In this webinar, Bruker present case studies that address improving yield, identifying root cause  failure and driving next generation device development from bare wafer to final packaged device.

Bruker will highlight requirements for advanced telecommunication, compact on-board electronics, and electric vehicles covering metrology needs for denser interconnect networks, finer redistribution layer (RDL), direct wafer to wafer bonding and wafer fan-out packaging.

Front end (FEOL) examples will include:

• Wafer bin roughness and edge roll-off
• CMP efficiency full die flatness
• CD metrology including TSV, deep trench RIE (Bosch process)
• Epi layer defect quantification in high power devices

Back end (BEOL) and packaging examples will address:

• Under Bump Metallisation (UBM)
• Recess defect inspection
• Full die screening for dense interconnect control

Speaker: Samuel Lesko, Senior Manager for Optical and Tribology Applications, Bruker Nano Surfaces Division