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In-Situ Nanomechanical Testing Mini Symposium

Tuesday and Wednesday 1 & 2 June 2021, 8:30pm AEST

 

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Probing the mechanical behaviour of materials at the nanoscale is necessary for the development of new nanostructured materials and continued miniaturization of engineering devices, electronic components, thin films, and surface coatings. This symposium will cover state of the art topics related to cutting edge developments in nanoscale mechanical characterization of materials such as metals, alloys, ceramics and organic crystals. The talks will demonstrate in-situ nano-mechanical testing techniques to extract site specific properties across temperatures and environments in a high throughput manner as well as introduce data science approaches for the same. The lecture themes are relevant to both audiences from academia and industry.

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Advanced In-Situ Nanomechanical Test Instrument

Bruker Nanosurfaces has announced the release of the Hysitron PI 89 SEM PicoIndenter, which provides nanomechanical testing capabilities inside a scanning electron miroscopy (SEM) at higher loads and in more extreme environments than previously possible. This will benefit researchers' understanding of the deformation mechanisms of high-strength materials.

 

The PI 89 SEM Picoindenter is the first in-situ instrument with two rotation and tllt stage configuations. This enables flexible sample positioning toward the electron column for top-dwn imaging, tilting toward the FIB column for milling, spindle rotation for crystallographic alignment, and compatibiltiy with a wide range of detectors to enable structure-property correlation of complex materials.

 

For further information please contact us or read more.

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Benchtop 3D Optical Profilometers

Bruker has released the next-generation benchtop ContourX 3D Optical Profilometers. The white light interferometry (WLI) platform features Bruker's new USI mode - a universal scanning mode that automatically determines the optimal measurement parameters for best metrology restuls. Additionally, a 5MP camera and new stage design significantly boosts large-area stitching, allowing for the collection of 1000 high-resolution stitched fields. This combination of features and capabilities enables greater convenience and productivity in a host of demanding research and industrial aplications ranging from studying novel material structures and characterising manufactured components for medical, automotive and aerospace.

 

For further information please contact us or read more.

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High Resolution AFM Imaging

The NanoWizard 4 XP Nanoscience atomic force microscope delivers atomic resolution and a large scan range of 100µm in one system. It enables fast scanning with rates of up to 150lines/sec and seamless integration with advanced optical techniques. A wide range of modes and accessories for environmental control, mapping of nanomechanical, electrical, magnetic or thermal properties, makes it the most flexible system available on the market today.

 

For further information please contact us or read more.

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Webinar : Cryogenic Sensor Installation Techniques

Friday 19 June, 12am, AEST

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Interested in knowing more about how to correctly install a sensor in a cryogenic application and to avoid common installation errors ? Then be sure to join this webinar presented by Dr Scott Courts, Lake Shore Senior Scientist/Metrologist.

This webinar will cover helpful, practical tips on how to choose the right type of sensor and packaging for a specific application and then summarise best practices for minimising installation errors and ensuring superior thermalisation in a cryogenic application.

Topics will include:

  • Considerations for choosing a sensor (including resistance to magnetic fields, ioning radiation, UHV and others)
  • The role of packaging and adapters for shielding, mounting, stability and optical thermal contact
  • Considerations for sensor installation (placement, mounting method, materials, electrical connections, heat sinking, thermal contact medium, etc)
  • A look at the choices for fastening materials, wire leads, thermal mediums and adhesives

 

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