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Benchtop 3D Optical Profilometers

Bruker has released the next-generation benchtop ContourX 3D Optical Profilometers. The white light interferometry (WLI) platform features Bruker's new USI mode - a universal scanning mode that automatically determines the optimal measurement parameters for best metrology restuls. Additionally, a 5MP camera and new stage design significantly boosts large-area stitching, allowing for the collection of 1000 high-resolution stitched fields. This combination of features and capabilities enables greater convenience and productivity in a host of demanding research and industrial aplications ranging from studying novel material structures and characterising manufactured components for medical, automotive and aerospace.


For further information please contact us or read more.

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High Resolution AFM Imaging

The NanoWizard 4 XP Nanoscience atomic force microscope delivers atomic resolution and a large scan range of 100µm in one system. It enables fast scanning with rates of up to 150lines/sec and seamless integration with advanced optical techniques. A wide range of modes and accessories for environmental control, mapping of nanomechanical, electrical, magnetic or thermal properties, makes it the most flexible system available on the market today.


For further information please contact us or read more.

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Webinar : Cryogenic Sensor Installation Techniques

Friday 19 June, 12am, AEST


Interested in knowing more about how to correctly install a sensor in a cryogenic application and to avoid common installation errors ? Then be sure to join this webinar presented by Dr Scott Courts, Lake Shore Senior Scientist/Metrologist.

This webinar will cover helpful, practical tips on how to choose the right type of sensor and packaging for a specific application and then summarise best practices for minimising installation errors and ensuring superior thermalisation in a cryogenic application.

Topics will include:

  • Considerations for choosing a sensor (including resistance to magnetic fields, ioning radiation, UHV and others)
  • The role of packaging and adapters for shielding, mounting, stability and optical thermal contact
  • Considerations for sensor installation (placement, mounting method, materials, electrical connections, heat sinking, thermal contact medium, etc)
  • A look at the choices for fastening materials, wire leads, thermal mediums and adhesives


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AFM-based Nanoscale DMA

The development of heterogeneous materials like polymer composites, blends and multilayers are of considerable importance in the chemicals industry. Bulk viscoelastic measurements are routine in establishing structure-property relationship for these materials. However, materials R&D often produces composites that contain nano-sized portions that do not exist in the bulk or that have properties influenced by the proximity of other components. A quantitative means of measuring the viscoelastic properties of such mterials at the nanoscale has been a long-standing and elusive goal for atomic force microscopy (AFM). While AFM has the sensitivity and resolution needed to do the measurement, traditional AFM-based approaches are hampered by difficult calibration, poorly defined measurement frequency, and inadequate modeling of the tip-sample interation.


Now, with the development of the AFM-nDMA mode from Bruker, these pitfalls can be avoided and the frequency and temperature depedence of viscoelastic properties in rheologically relevant ranges can be directly measured with 10nm spatial resolution. Read more or download the application note.

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Webinar : Accelerating Semiconductor Processes Control

Tuesday 17 December

            Auckland (NZDT) : 10:00pm
            Brisbane (AEST) : 7:00pm
            Sydney, Canberra, Melbourne, Hobart (AEDT) : 8:00pm
            Adelaide (ACDT) : 7:30pm
            Perth (AWST) : 5:00pm


Recent advances in 3D Optical Metrology accelerate in-line quality control for both front and back end processes. In this webinar, Bruker present case studies that address improving yield, identifying root cause  failure and driving next generation device development from bare wafer to final packaged device.

Bruker will highlight requirements for advanced telecommunication, compact on-board electronics, and electric vehicles covering metrology needs for denser interconnect networks, finer redistribution layer (RDL), direct wafer to wafer bonding and wafer fan-out packaging.

Front end (FEOL) examples will include:

  • Wafer bin roughness and edge roll-off
  • CMP efficiency full die flatness
  • CD metrology including TSV, deep trench RIE (Bosch process)
  • Epi layer defect quantification in high power devices

Back end (BEOL) and packaging examples will address:

  • Under Bump Metallisation (UBM)
  • Recess defect inspection
  • Full die screening for dense interconnect control

Speaker: Samuel Lesko, Senior Manager for Optical and Tribology Applications, Bruker Nano Surfaces Division

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